Integration engineer Silicon Photonics, Advanced Assembly and 3D Packaging (Japan)

Support the development and implementation of innovative integration flows required for fabrication and assembly of advanced optical engines in our new Hokkaido (Japan) office!

What you will do

Your mission as Integration engineer Silicon Photonics, Advanced Assembly and 3D Packaging will be to support the development of process flows for optical engines that rely on Silicon Photonics, assembled through various hybrid bonding steps with advanced electronics and advanced substrates. You will join our team in Hokkaido, Japan; in addition you will spend time at imec HQ, Leuven, Belgium, working closely with the integration engineers. Finally, you will be the liaison between imec and Japanese collaborative partners, driving the integration flow.  

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its location in Hokkaido, Japan. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will define the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate reward package.

Who you are

• You hold a Master’s or PhD in science or engineering, preferably with a focus on semiconductor process technology and materials characterization.
• Experience in semiconductor processing or integration is essential; familiarity with silicon photonics and device engineering is a strong advantage.
• 7+ years of experience in semiconductor processing or integration is expected. You can interpret in-line, electrical, and optical test data and relate it to wafer fabrication processes.
• Skills in Design of Experiments, statistical analysis, and data-driven decision-making are highly valued.
• You are an enthusiastic team player with strong organizational and project management capabilities, able to complete tasks independently and on time.
• Good communication skills, fluency in both Japanese and English are critical assets for this position.